With the use of SPC and on-line real-time WIP tracking, Hana can provide timely information to meet the requirements of cycle time and yield per customer's demand and expectation.

Hana uses state of the art and the latest semiconductor equipment in our assembly and final test line. Test capability include NON-VOLATILE MEMORY, FLASH MEMORY, MIX SIGNAL, DISCRETE, LINEAR and ANALOG applications.

Hana Semiconductor (Ayutthaya) is offering a complete turnkey sub-contractor service including Wafer test, Wafer back grinding, Assembly and Test, Dicing, Drop shipment and reliability test services.

During the past 3 years, several new packages have been introduced including an "Image Sensor package" used for the latest mobile phone, digital camera and Web Camera. In the 'tiny package' range Hana can offer SC70, FC-SC70, VSOP and SOT23 packages, which are widely used in the telecommunication industry. Our latest package recently introduced to the market, is the smallest package in the 'tiny package' family called " Land Grid Array Package ".

Aside from the standard I.C. packages, Hana Semiconductor (Ayutthaya) can also offering custom design / specific I.C. package assembly and test services. Our design and project engineers can develop custom packages to meet specific requirements.